Processing, Materials, and Integration of Damascene and 3D Interconnects
This issue focuses on recent advances in damascene interconnects and 3D interconnects.Different Sizes a Equal Challenges According to the ITRS roadmap (1), global wiring is usually designed with higher aspect ratios than intermediate wiring. This should provide some margin for smaller structures that have to be created withanbsp;...
| Title | : | Processing, Materials, and Integration of Damascene and 3D Interconnects |
| Author | : | J. C. Flake |
| Publisher | : | The Electrochemical Society - 2010-04 |
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